Garnet waterjet cutting?
Garnet waterjet cutting is a process that uses high-pressure water flow with added garnet abrasive for cutting. The following is a detailed introduction to garnet waterjet cutting:
1、 Working principle
Garnet water jet cutting: high-pressure water flow with garnet is added and sprayed at high speed onto the object to be cut, using the impact force of the water flow and the grinding effect of garnet abrasive to achieve the cutting purpose.This cutting method combines the dual effects of physical impact and chemical grinding, and can efficiently and accurately cut various materials.
2、 Advantages
Fast cutting speed: Garnet waterjet cutting can complete complex shape cutting in a short time, improving production efficiency.
High cutting accuracy: Due to the stability of high-pressure water flow and the uniform distribution of garnet abrasive, high-precision control can be achieved, whether it is fine pattern carving or complex contour cutting, ideal results can be achieved.
Environmentally friendly and pollution-free: Compared with traditional cutting methods, garnet waterjet cutting basically does not produce dust, and the water during the cutting process can be recycled, reducing water resource consumption and waste emissions.
3、 Selection of Garnet Abrasive
Particle size: The particle size of garnet abrasive directly affects the cutting effect. 80 mesh ： processing ceramics and rock slabs; 60 mesh waterjet sand ：processing stainless steel, copper, and marble materials.
Quality: Garnet undergoes water washing, screening, and magnetic separation to ensure that the product is clean, dust-free, and free of fine particles. Avoiding the situation where the particles are too coarse and cause clogging of the water cutting blade.
4、 Application Fields
The garnet waterjet cutting has been widely
Aerospace: used for cutting precision components and composite materials.
Construction industry: used for stone processing, glass cutting, etc.
Artistic creation: used for various carvings and pattern making.